Wide Technology Design Experience

Si: CMOS (0.18um,0.13um, 65nm)
SiGe: BICMOS (0.35um)
GaAs/InGaP: PHEMT(0.5um), HBT

Wafer Foundries and Backend Companies

TSMC/SMIC/UMC/IBM/HHNEC/Chartered: CMOS, SiGe-BiCMOS
WIN: PHEMT, HBT
ASE/KYEC/KYT: Package, Testing

Strong Module Partners

Jorjin: Minaturized PCB Module, Antenna Design Support
Ceramicro: SiP Module (LTCC, Organic Substrate)

Baseband algorithm/system design transfer

Full Design Transfer

GDS Only Transfer

ASIC Design